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Alliance Memory - New LPDDR4 SDRAM devices

Alliance Memory has expanded its offering of high-speed CMOS mobile low-power SDRAMs with new LPDDR4 devices coming with on-chip ECC, densities of 2Gb, 4Gb, and 8Gb and fast speeds of 1600MHz in the 200-ball FBGA package.

Available Options

  • AS4C128M16MD4-062BAN – 1-channel device of 2 Gb density, configured as 128M x16 bit in 8 internal banks
  • AS4C256M16MD4-062BAN – 1-channel device of 4 Gb density, configured as 256M x16 bit in 8 internal banks
  • AS4C128M32MD4-062BAN – 2-channel device of 4 Gb density, configured as 128M x32 bit in 16 internal banks
  • AS4C256M32MD4-062BAN – 2-channel device of 8 Gb density, configured as 256M x32 bit in 16 internal banks

Additional features

  • On-chip ECC
  • Low-voltage core and I/O power voltages
  • LVSTL I/O interface
  • Internal VREF and VREF training
  • Dynamic ODT
  • Max. clock frequency of 1.6 GHz
  • 16-bit pre-fetch data bus
  • On-chip temperature sensor

All chips use a 200-ball FBGA package (10mm x 14.5mm) with 0.8mm (2Gb/4Gb) and 1.1mm (8Gb) height, having Automotive A2 operating temperature range (TC = -40°C to +105°C).

Target application areas

  • Mobile (handsets and tablets)
  • Consumer electronics (DTV, cameras, wearables etc.)
  • Portable electronics
  • Networking
  • Automotive devices
  • And many more

> Get your Datasheet [PDF]

 

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Download datasheet (PDF)